Post-CMP Cleaning Solution "CMP Series"
Various post-CMP cleaning solutions with excellent removal performance for metal impurities and particles.
High-performance post-CMP cleaning solution designed for efficient removal of residual metal impurities, particles, and organic matter from wafers. No damage to various metal materials or interlayer insulating films. 【Features】 ■ Excellent cleaning ability against various contaminants after CMP ■ Can be used in diluted form (approximately 30 to 100 times) *For more details, please feel free to contact us.
